High vacuum versus ultrahigh vacuum technology

Ultrahigh vaccum conditions are needed in many modern sputtering applications as the fabrication of Magnetic Read/Write Heads, numerous Semiconductor Processes and opto-Electronic Device Processing. In such applications UHV is necessary to reduce surface contamination during thin film growth and to cope with stringent purity requirements. 

For such demanding applications in industry and for fundamental research THIN FILM CONSUTLING designed IONIX® sputtering sources for high-precision UHV sputtering. These sources are dedicated to accurate and reproducible and ultra-pure thin film deposition.

Our IONIX® UHV sputtering sources are manufactured entirely from UHV-compatible materials with low outgassing rates. They contain only metallic seals and can be baked with their magnet array up to 200°C. These feaures enables sputter deposition in an ultra pure environment eliminating unintentional oxidation or nitriding of materials. 

IONIX® high vacuum sputtering sources: IONIX® ultrahigh vacuum sputtering sources:
  • viton seals vacuum-to-atmosphere
  • no water-to-vacuum seals
  • magnets completely separated from cooling water
  • with magnets bakeable up to 60°C
  • metallic seals vacuum-to-atmosphere
  • no water-to-vacuum seals
  • magnets completely separated from cooling water
  • with magnets bakeable up to 200°C
  • UHV compatible construction materials