IONIX® Dual Magnetron Solutions
In the field of large area coatings often dielectrics or transparent conductive oxide (TCO) layers are deposited in a reactive sputtering process. Commonly a dual magnetron system is used for high rate reactive sputter deposition of these materials. Utilizing this method, a pair of magnetron sputtering sources is used, alternating roles as anode an cathode avoiding the disappearing anode problem.
Also, dual magnetron systems can be used for reactive- or non reactive deposition of conductive materials if deposition rates should be high and coating time short.
IONIX® dual magnetron system are available in a variety of different, varying from small systems of target size 2''x15'' for research or small-scale production to systems as large as 5''x117'' for large-area coatings.
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